The MC1322x series of devices is NXP’s newest addition to its family of 802.15.4/ZigBee wireless connectivity solutions. The platform in a package, or PiP, series has an integrated third generation of transceiver and 32-bit ARM7 TDMI-S controller in a single chip. The solution significantly reduces component count. Now the designer may implement a node with only the addition of an antenna and oscillator for substantial savings in board space, complexity, design time, inventory count and system cost. The low power consumption of these products is very competitive in the market today with 21mA in receive and 28mA in transmit. The power output is software selectable from -30dBm to +5dBm. There are 3 low power and 6 run modes for flexible power management alternatives. The series can support point-to-point, star, cluster-tree, and mesh networks and the device has 128KB of Flash memory mirrored into 96KB of RAM and 80K of ROM. The solutions provide less than -100dBm sensitivity in NCD mode (+3-4mA current) and provide access to up to 64 GPIO pins. The combination of peripherals includes an 8-channel, 12-bit analog to digital converter, 4 timers/PWM, 2 SCI, I²C, SCI, and I²S. The operating voltage ranges from 1.8V to 3.6V and the operating temperature range is from -40 to +105˚C. The 9.5 x 9.5 x 1mm 99-pin LGA package allows implementation of a node with antenna and oscillator in less than 110mm².