In summary, innovation in both silicon and package cases has enabled Diodes Inc. to create a small, self protected MOSFET. By adding to its IntelliFET product range, Diodes Inc. has introduced a small, fully self protected low side MOSFET. Packaged in the 2.3mm x 2.8mm footprint ‘flat’ SOT23F package, the ZXMS6004FF takes 6.5 times less board space than incumbent 7.3mm x 6.7mm footprint SOT223 packaged parts. Integrating ESD, over-voltage, over-current and over-temperature protection into a single thermally efficient package, the ZXMS6004FF protects both itself and the load and will help reduce component count, PCB size and overall system cost in a range of automotive and industrial applications. Despite its miniature format, the superior thermal performance of the SOT23 flat package enables the ZXMS6004FF to deliver a package power density three times that of its much larger packaged counterpart and a footprint six times smaller. The device’s ultra small form factor will also enable space restricted applications to integrate self protected MOSFETs for the very first time. The device has a continuous current rating of 1A and is qualified to the AECQ101 standard, being tolerant of 60V load dump transients. With a logic level input of either 3.3V or 5V, the ZXMS6004FF can be driven directly from microcontroller outputs.