The MEMS switch technology is based on an internal Analog Devices manufacturing process in a sub-micron semiconductor Class 1 clean room. The first two parts, ADGM1304 and ADGM1004, are based on a cantilever switch beam design. This cantilever beam has 5 contacts in parallel to increase the power handling and reduce on resistance. The switch is electrostatically actuated by a DC voltage applied to a gate electrode under the switch beam, with this voltage supplied via a co-packaged driver IC. This IC is a charge pump that produces the drive voltage to actuate the switches. The switches are hermetically sealed by a silicon cap using the same capping process used for other ADI MEMS products, so there are no dry-switching limitations. The ADGM1304 and ADGM1004 are packaged in a 5 mm x 4 mm plastic lead frame or QFN package.