Heat Sinks

Results: 11

Filters

Stacked

Scrolling

Showing

of 11

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish

V5618A HEATSINK ALUM ANOD Assmann WSW Components	27,220 In Stock 11,000 Factory	1 : ¥3.86000 Bulk	-	Bulk	Active	Top Mount	6-Dip and 8-Dip	Press Fit	Rectangular, Fins	0.334" (8.50mm)	0.250" (6.35mm)	-	0.189" (4.80mm)	-	-	80.00°C/W	Aluminum	Black Anodized
577202B00000G HEAT SINK TO-220 .500" COMPACT Boyd Laconia, LLC	6,349 In Stock	1 : ¥4.10000 Bag	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.500" (12.70mm)	1.5W @ 40°C	10.00°C/W @ 200 LFM	24.40°C/W	Aluminum	Black Anodized
507302B00000G HEATSINK TO-220 2.5W LOW PROFILE Boyd Laconia, LLC	1,817 In Stock	1 : ¥8.13000 Bulk	-	Bulk	Active	Board Level	TO-220	Bolt On	Square, Fins	0.750" (19.05mm)	0.750" (19.05mm)	-	0.380" (9.65mm)	2.5W @ 60°C	10.00°C/W @ 200 LFM	24.00°C/W	Aluminum	Black Anodized
HSB05-171711 HEAT SINK, BGA, 17 X 17 X 11.5 M CUI Devices	6,432 In Stock	1 : ¥8.87000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.453" (11.50mm)	3.1W @ 75°C	8.40°C/W @ 200 LFM	23.91°C/W	Aluminum Alloy	Black Anodized
V5619A HEATSINK ALUM ANOD Assmann WSW Components	6,945 In Stock	1 : ¥2.96000 Bulk	-	Bulk	Active	Top Mount	14-DIP and 16-DIP	Press Fit	Rectangular, Fins	0.250" (6.35mm)	0.748" (19.00mm)	-	0.190" (4.83mm)	-	-	48.00°C/W	Aluminum	Black Anodized
V2016B HEATSINK CPU XCUT Assmann WSW Components	30,365 In Stock 4,800 Factory	1 : ¥3.20000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.335" (8.50mm)	0.335" (8.50mm)	-	0.315" (8.00mm)	-	-	32.00°C/W	Aluminum Alloy	Black Anodized
HSB02-101007 HEAT SINK, BGA, 10 X 10 X 7 MM CUI Devices	5,523 In Stock	1 : ¥5.50000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.275" (7.00mm)	2.0W @ 75°C	16.50°C/W @ 200 LFM	37.90°C/W	Aluminum Alloy	Black Anodized
HSB03-121218 HEAT SINK, BGA, 12 X 12 X 18 MM CUI Devices	1,994 In Stock	1 : ¥7.47000 Tray	HSB	Tray	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.472" (12.00mm)	0.472" (12.00mm)	-	0.709" (18.00mm)	3.1W @ 75°C	9.60°C/W @ 200 LFM	24.01°C/W	Aluminum Alloy	Black Anodized
501200B00000G HEATSINK 14-16 DIP BLACK .19" Boyd Laconia, LLC	2,128 In Stock	1 : ¥7.88000 Bag	-	Bag	Active	Top Mount	14-DIP and 16-DIP	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	0.250" (6.35mm)	0.731" (18.57mm)	-	0.190" (4.83mm)	0.4W @ 30°C	50.00°C/W @ 200 LFM	68.00°C/W	Aluminum	Black Anodized
V2283E1 PROFILE HEATSINK, FLAT BACK, AL6 Assmann WSW Components	0 In Stock Check Lead Time	5,000 : ¥4.50416 Bulk	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Fins	0.276" (7.00mm)	0.276" (7.00mm)	-	0.216" (5.50mm)	-	-	87.00°C/W	Aluminum Alloy	Black Anodized
PRT-11510 SMALL HEATSINK SparkFun Electronics	0 In Stock	1 : ¥17.24000 Bulk	-	Bulk	Discontinued at Digi-Key	Top Mount	Allegro A4983	-	Rectangular, Fins	0.250" (6.35mm)	0.190" (4.83mm)	-	0.300" (7.62mm)	-	-	-	-	Black Anodized

Showing

of 11

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.