Heat Sinks

Results: 7
Manufacturer
Boyd Laconia, LLCCUI Devices
Series
-HSEHSS
Packaging
BagBox
Type
Board LevelBoard Level, Vertical
Package Cooled
TO-220TO-220 (Dual)
Attachment Method
Bolt OnBolt On and PC PinPC Pin
Length
0.500" (12.70mm)0.520" (13.20mm)0.950" (24.13mm)0.984" (25.00mm)1.180" (29.97mm)1.450" (36.83mm)
Width
0.375" (9.53mm)0.625" (16.00mm)0.780" (19.81mm)1.000" (25.40mm)1.750" (44.45mm)
Fin Height
0.354" (9.00mm)0.370" (9.40mm)0.500" (12.70mm)0.748" (19.00mm)0.850" (21.60mm)1.180" (29.97mm)
Power Dissipation @ Temperature Rise
1.0W @ 20°C2.7W @ 75°C3.8W @ 75°C4.0W @ 40°C4.6W @ 75°C6.5W @ 75°C
Thermal Resistance @ Forced Air Flow
3.76°C/W @ 200 LFM5.00°C/W @ 200 LFM5.00°C/W @ 400 LFM5.44°C/W @ 200 LFM6.12°C/W @ 200 LFM9.00°C/W @ 200 LFM9.51°C/W @ 200 LFM
Thermal Resistance @ Natural
6.40°C/W11.54°C/W13.60°C/W16.30°C/W16.60°C/W19.74°C/W27.78°C/W
Material
AluminumAluminum Alloy
Stocking Options
Environmental Options
Media
Marketplace Product
7Results
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of 7
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSE-B2111-038
HSE-B2111-038
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
13,659
In Stock
1 : ¥2.55000
Box
Box
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
0.625" (16.00mm)
-
0.354" (9.00mm)
3.8W @ 75°C
6.12°C/W @ 200 LFM
19.74°C/W
Aluminum Alloy
Black Anodized
HSS-B20-NP-04
HSS-B20-NP-04
HEATSINK TO-220 6.5W ALUMINUM
CUI Devices
5,579
In Stock
1 : ¥3.69000
Box
Box
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
1.450" (36.83mm)
1.750" (44.45mm)
-
0.370" (9.40mm)
6.5W @ 75°C
3.76°C/W @ 200 LFM
11.54°C/W
Aluminum
Black Anodized
575002B00000G
575002B00000G
HEATSINK TO-220 TABS BLACK
Boyd Laconia, LLC
1,135
In Stock
1 : ¥4.35000
Bag
-
Bag
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.180" (29.97mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
1.0W @ 20°C
5.00°C/W @ 400 LFM
13.60°C/W
Aluminum
Black Anodized
504222B00000G
504222B00000G
HEATSINK TO-220 PWR CLR 1.45"10W
Boyd Laconia, LLC
4,147
In Stock
1 : ¥18.31000
Bag
-
Bag
Active
Board Level
TO-220 (Dual)
Bolt On
Rectangular, Fins
1.450" (36.83mm)
0.780" (19.81mm)
-
0.850" (21.60mm)
4.0W @ 40°C
5.00°C/W @ 200 LFM
6.40°C/W
Aluminum
Black Anodized
576602B00000G
576602B00000G
HEATSINK TO-220 VERT MNT .95"
Boyd Laconia, LLC
3,455
In Stock
1 : ¥19.29000
Bag
-
Bag
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.950" (24.13mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
1.0W @ 20°C
9.00°C/W @ 200 LFM
16.60°C/W
Aluminum
Black Anodized
HSS-B20-0503H
HSS-B20-0503H
HEATSINK TO-220 4.6W ALUMINUM
CUI Devices
2,303
In Stock
1 : ¥5.34000
Box
Box
Active
Board Level, Vertical
TO-220
PC Pin
Rectangular, Fins
0.500" (12.70mm)
1.000" (25.40mm)
-
1.180" (29.97mm)
4.6W @ 75°C
5.44°C/W @ 200 LFM
16.30°C/W
Aluminum
Black Anodized
HSS-B20-0635H-01
HSS-B20-0635H-01
HEATSINK TO-220 2.7W ALUMINUM
CUI Devices
932
In Stock
1 : ¥4.02000
Bag
Bag
Active
Board Level, Vertical
TO-220
PC Pin
Rectangular, Fins
0.520" (13.20mm)
0.375" (9.53mm)
-
0.748" (19.00mm)
2.7W @ 75°C
9.51°C/W @ 200 LFM
27.78°C/W
Aluminum
Black Anodized
Showing
of 7

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.