Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish

APF19-19-10CB HEATSINK LOW-PROFILE FORGED CTS Thermal Management Products	22,232 In Stock	1 : ¥21.92000 Box	APF	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.370" (9.40mm)	-	5.30°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS-CPX025025015-138-C2-R0 HEATSINK 25X25X15MM L-TAB CP Advanced Thermal Solutions Inc.	2,576 In Stock	1 : ¥26.93000 Bulk	pushPIN™	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.590" (15.00mm)	-	12.18°C/W @ 100 LFM	-	Aluminum	Blue Anodized
V2022B HEATSINK CPU XCUT Assmann WSW Components	3,925 In Stock	1 : ¥4.84000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.236" (6.00mm)	-	-	24.00°C/W	Aluminum Alloy	Black Anodized
HSB04-171706 HEAT SINK, BGA, 17 X 17 X 6 MM CUI Devices	1,642 In Stock	1 : ¥6.65000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.236" (6.00mm)	2.5W @ 75°C	13.10°C/W @ 200 LFM	29.73°C/W	Aluminum Alloy	Black Anodized
HSB09-212115 HEAT SINK, BGA, 21 X 21 X 15 MM CUI Devices	1,531 In Stock	1 : ¥7.64000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.591" (15.00mm)	4.3W @ 75°C	6.00°C/W @ 200 LFM	17.39°C/W	Aluminum Alloy	Black Anodized
HSB15-404010 HEAT SINK, BGA, 40 X 40 X 10 MM CUI Devices	494 In Stock	1 : ¥9.11000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.394" (10.00mm)	6.3W @ 75°C	3.90°C/W @ 200 LFM	11.84°C/W	Aluminum Alloy	Black Anodized
HSB26-343408 HEAT SINK, BGA, 33.5 X 33.5 X 8 CUI Devices	750 In Stock	1 : ¥9.36000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.319" (33.50mm)	1.319" (33.50mm)	-	0.315" (8.00mm)	4.94W @ 75°C	5.30°C/W @ 200 LFM	15.19°C/W	Aluminum Alloy	Black Anodized
HSB11-252518 HEAT SINK, BGA, 25 X 25 X 18 MM CUI Devices	2,873 In Stock	1 : ¥10.51000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.709" (18.00mm)	5.5W @ 75°C	4.50°C/W @ 200 LFM	13.70°C/W	Aluminum Alloy	Black Anodized
HSB23-232325 HEAT SINK, BGA, 23 X 23 X 25 MM CUI Devices	355 In Stock	1 : ¥11.25000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.984" (25.00mm)	6.13W @ 75°C	3.80°C/W @ 200 LFM	12.23°C/W	Aluminum Alloy	Black Anodized
TGH-0200-02 ALUMINIUM HEAT SINK 20X20MM t-Global Technology	921 In Stock	1 : ¥16.09000 Bulk	TGH	Bulk	Active	Top Mount	-	-	Square, Fins	0.787" (20.00mm)	0.787" (20.00mm)	-	0.236" (6.00mm)	-	-	-	Aluminum	Black Anodized
ATS-54170D-C1-R0 HEAT SINK 17MM X 17MM X 9.5MM Advanced Thermal Solutions Inc.	900 In Stock	1 : ¥57.39000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.374" (9.50mm)	-	24.30°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSB24-252510 HEAT SINK, BGA,25 X 25 X 10 MM CUI Devices	794 In Stock	1 : ¥6.65000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	4.14W @ 75°C	6.50°C/W @ 200 LFM	18.10°C/W	Aluminum Alloy	Black Anodized
V2269E1 CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	0 In Stock 2,808 Factory Check Lead Time	1 : ¥8.54000 Bulk	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.787" (20.00mm)	0.787" (20.00mm)	-	0.354" (9.00mm)	-	-	27.00°C/W	Aluminum Alloy	Black Anodized

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Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.