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The first feature is that this device has higher efficiency than comparable solutions. On the top right side of this slide, an efficiency curve is shown that compares the ISOW7841 efficiency, represented by red and orange lines, vs. the competitor’s device shown in blue and green lines. The two lines for each device are for the two supply voltages 5V and 3.3V. As seen from the image, the efficiency of the competitor’s device is about 30% whereas the ISOW7841 device has 50%. The lower image shows the test PC boards used for evaluating the two devices and the thermal performance of these boards taken by a thermal camera when the parts are tested under identical conditions. As can be seen in the thermal images, the competitor’s device hotspot is at about 90°C while the ISOW7841 has a hotspot of 50°C, thereby running 40°C cooler. This lower temperature is due to the low power consumption of the ISOW7841 device. This temperature performance helps customers due to the lower power consumption of the device itself, and it ensures that a higher amount of power is delivered to the output. This device delivers 130mA at 5V, providing 650mW of output power. In applications such as PLCs, there could be anywhere from 8 to 256 isolators used on the digital I/O modules. Every channel running 40°C cooler would help minimize the temperature of the entire system, thereby enabling more channel counts to be stacked without overheating concerns. In addition, with lower operating temperatures the device will also enable longer system lifetimes.
