ST’s MEMS microphones are multi-die devices with an acoustic sensor, a CMOS IC, and the package itself. The IC functions to convert the changing capacitance that occurs in the sensor and creates an analog or digital output. The package is critical both in terms of performance and cost. The expertise that ST has developed for the packaging of other MEMS products, such as accelerometers and gyroscopes, the large investments in MEMS manufacturing capability, and control over the full supply chain give ST a clear advantage over the competition.