Octavo Systems has pulled decades of Integrated Circuit and System Design experience together to create easy to use building blocks to build a product or application. Each block is a System-In-Package, or SiP, which is a device that looks like a single IC to the end user. Contained in this IC package are many different electronic components all working together as a single system. A typical Octavo Systems SiP, like the one shown here, contains a Processor System-on-Chip, various types of memory, power circuitry and over 100 passive components in a standard wide-pitch BGA package. The Octavo Systems SiPs use bare silicon die, allowing each to take advantage of the latest advancements in IC design and manufacturing processes. This allows the SiPs to be about half the size of an equivalent system made of individual components while being as cost effective and more reliable. Through design innovations at Octavo Systems, this System-in-Package technology is more accessible to all, allowing for the continued development of smaller, cheaper, and more innovative products.