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OSD335x C-SiP System-in-Package Family Slide 2
Octavo Systems was founded in 2013 by three senior semiconductor technology leaders, all of whom had been associated with Texas Instruments. The founders observed that Gordon Moore’s vision (“Moore’s Law”) has been applied effectively to semiconductor components but has yet to be realized at the system level. As semiconductor designers continue to push the boundaries of size, power, and performance it is becoming exorbitantly expensive to integrate all of the system functions into a single silicon device. Major semiconductor manufacturers have been aware of this for some time and have instead packaged multiple die with different functions into a single package to meet their requirements. Unfortunately, this “System-in-Package” technology has only been accessible to the largest customers or to very specific products in high-priced applications. Octavo Systems’ mission is to bring these capabilities to the masses, allowing Moore’s vision to continue at the system level and to make designing electronic systems as easy as possible through System-In-Package Technology.
PTM Published on: 2019-01-22