Direct Matching Assembly process, is applied to all NXP Varactor diodes. The reason for this extensive and costly process is to offer customers batches of Varactor diodes with lowest possible spread. This will ease the customer’s design and production process. All wafers are subject to a DC test. This way each individual Varactor diode on the wafer is characterized. Then, an individual assembly sequence is created for each wafer. Furthermore, using a computer all diodes are being compared and sorted in batches to have a lowest possible spread. Using a matching software provides a fast and accurate method for sorting the individual Varactor diodes.