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To demonstrate this robustness, flipchip eGaN FETs mounted on PCBs were tested at extreme temperature and/or humidity environments. These tests include: High Temperature High Humidity Reverse Bias (H3TRB); High Temperature Storage (HTS); Temperature Cycling (TC); Moisture Sensitivity Level (MSL); and Autoclave (Unbiased Pressure Cooker-AC). The table on this slide summarizes the test results from over 780 individual eGaN FETs. As can be seen from the table, mounted flipchip eGaN FETs are robust against harsh temperature and humidity environments without the added complexity, size, and cost of a conventional plastic molded package.

PTM Published on: 2011-04-06
PTM Updated on: 2016-03-30