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The SMT solder process uses 3 basic machines, the PCB solder screening or paste printing, the component pick and place, and the component and PCB convection reflow. Due to the requirements of lead-free processing, a higher reflow temperature is needed to liquefy the solder. Components suitable for SMT reflow soldering must withstand 260°C for a minimum of 30 seconds.
PTM Published on: 2011-10-27
