Heat Sinks

Results: 17
Manufacturer
Advanced Thermal Solutions Inc.Boyd Laconia, LLCWakefield-Vette
Series
-960fanSINK™maxiFLOWpushPIN™
Packaging
BulkTray
Type
Top MountTop Mount, Skived
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)BGAEighth Brick DC/DC ConverterFull Brick DC/DC ConverterHalf Brick DC/DC Converter
Attachment Method
Bolt OnPush PinPush Pin, Thermal Material
Shape
Rectangular, Angled FinsSquare, FinsSquare, Pin Fins
Length
0.748" (19.00mm)0.984" (25.00mm)1.575" (40.00mm)2.087" (53.02mm)2.283" (58.00mm)2.323" (59.00mm)2.362" (60.00mm)2.480" (63.00mm)2.756" (70.00mm)2.913" (74.00mm)3.150" (80.00mm)3.307" (84.00mm)4.598" (116.80mm)
Width
0.748" (19.00mm)0.906" (23.00mm)0.984" (25.00mm)1.575" (40.00mm)2.087" (53.02mm)2.362" (60.00mm)2.401" (61.00mm)2.480" (63.00mm)2.756" (70.00mm)2.913" (74.00mm)3.150" (80.00mm)3.307" (84.00mm)
Fin Height
0.374" (9.50mm)0.394" (10.00mm)0.449" (11.40mm)0.472" (12.00mm)0.571" (14.50mm)0.590" (15.00mm)0.790" (20.00mm)0.902" (22.90mm)0.965" (24.50mm)0.984" (25.00mm)
Thermal Resistance @ Forced Air Flow
1.20°C/W @ 200 LFM1.30°C/W @ 200 LFM2.18°C/W @ 100 LFM2.66°C/W @ 100 LFM4.44°C/W @ 100 LFM5.20°C/W @ 200 LFM6.80°C/W @ 200 LFM7.30°C/W @ 200 LFM9.10°C/W @ 100 LFM11.79°C/W @ 100 LFM12.18°C/W @ 100 LFM-
Thermal Resistance @ Natural
5.10°C/W-
Material
-AluminumCopper
Material Finish
-AavSHIELD 3CBlack AnodizedBlue AnodizedGold Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
17Results
Showing
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
1,835
In Stock
1 : ¥26.93000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.984" (25.00mm)
0.984" (25.00mm)
-
0.590" (15.00mm)
-
12.18°C/W @ 100 LFM
-
Aluminum
Blue Anodized
960
960-19-15-D-AB-0
HEATSINK 19X15MM DIA PUSH PIN
Wakefield-Vette
853
In Stock
1 : ¥39.90000
Tray
Tray
Active
Top Mount
BGA
Push Pin
Square, Pin Fins
0.748" (19.00mm)
0.748" (19.00mm)
-
0.590" (15.00mm)
-
6.80°C/W @ 200 LFM
-
Aluminum
Black Anodized
247
In Stock
1 : ¥40.97000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.984" (25.00mm)
0.984" (25.00mm)
-
0.590" (15.00mm)
-
12.18°C/W @ 100 LFM
-
Aluminum
Blue Anodized
ATS-1179-C1-R0
ATS-1179-C1-R0
1/8 BRICK HEATSINK 58X23X11.4MM
Advanced Thermal Solutions Inc.
1,835
In Stock
1 : ¥86.37000
Bulk
Bulk
Active
Top Mount
Eighth Brick DC/DC Converter
Bolt On
Rectangular, Angled Fins
2.283" (58.00mm)
0.906" (23.00mm)
-
0.449" (11.40mm)
-
7.30°C/W @ 200 LFM
-
Aluminum
Gold Anodized
3,788
In Stock
1 : ¥28.49000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.394" (10.00mm)
-
11.79°C/W @ 100 LFM
-
Aluminum
Blue Anodized
6,530
In Stock
1 : ¥32.59000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
2.362" (60.00mm)
2.362" (60.00mm)
-
0.984" (25.00mm)
-
2.66°C/W @ 100 LFM
-
Aluminum
Blue Anodized
ATS-61500K-C2-R0
ATS-61500K-C2-R0
FANSINK ASSEMBLY W/ MOUNTING HAR
Advanced Thermal Solutions Inc.
156
In Stock
1 : ¥170.44000
Bulk
Bulk
Active
Top Mount
BGA
Push Pin, Thermal Material
Square, Pin Fins
2.087" (53.02mm)
2.087" (53.02mm)
-
0.571" (14.50mm)
-
-
-
-
-
342949
342949
COPPER HEATSINK 80X80X12MM
Boyd Laconia, LLC
171
In Stock
1 : ¥364.76000
Tray
-
Tray
Active
Top Mount, Skived
BGA
Push Pin
Square, Fins
3.150" (80.00mm)
3.150" (80.00mm)
-
0.472" (12.00mm)
-
1.20°C/W @ 200 LFM
5.10°C/W
Copper
AavSHIELD 3C
3,213
In Stock
1 : ¥19.46000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.984" (25.00mm)
0.984" (25.00mm)
-
0.790" (20.00mm)
-
9.10°C/W @ 100 LFM
-
Aluminum
Blue Anodized
305
In Stock
1 : ¥54.35000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
2.756" (70.00mm)
2.756" (70.00mm)
-
0.590" (15.00mm)
-
4.44°C/W @ 100 LFM
-
Aluminum
Blue Anodized
113
In Stock
1 : ¥101.23000
Tray
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
2.756" (70.00mm)
2.756" (70.00mm)
-
0.984" (25.00mm)
-
2.18°C/W @ 100 LFM
-
Aluminum
Blue Anodized
ATS-1146-C1-R0
ATS-1146-C1-R0
1/2 BRICK HEATSINK 58X61X22.9MM
Advanced Thermal Solutions Inc.
28
In Stock
1 : ¥165.10000
Bulk
Bulk
Active
Top Mount
Half Brick DC/DC Converter
Bolt On
Rectangular, Angled Fins
2.323" (59.00mm)
2.401" (61.00mm)
-
0.902" (22.90mm)
-
1.30°C/W @ 200 LFM
-
Aluminum
Gold Anodized
ATS-61800W-C2-R0
ATS-61800W-C2-R0
FANSINK ASSEMBLY W/ MOUNTING HAR
Advanced Thermal Solutions Inc.
34
In Stock
1 : ¥267.97000
Bulk
Bulk
Active
Top Mount
BGA
Push Pin, Thermal Material
Square, Pin Fins
3.307" (84.00mm)
3.307" (84.00mm)
-
0.965" (24.50mm)
-
-
-
-
-
ATS-61700D-C2-R0
ATS-61700D-C2-R0
FANSINK ASSEMBLY W/ MOUNTING HAR
Advanced Thermal Solutions Inc.
56
In Stock
1 : ¥215.18000
Bulk
Bulk
Active
Top Mount
BGA
Push Pin, Thermal Material
Square, Pin Fins
2.913" (74.00mm)
2.913" (74.00mm)
-
0.374" (9.50mm)
-
-
-
-
-
0
In Stock
Check Lead Time
1 : ¥87.43000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
2.756" (70.00mm)
2.756" (70.00mm)
-
0.984" (25.00mm)
-
2.18°C/W @ 100 LFM
-
Aluminum
Blue Anodized
ATS-1109-C1-R0
ATS-1109-C1-R0
FULL BRICK HEATSINK 117X61X11.4M
Advanced Thermal Solutions Inc.
0
In Stock
Check Lead Time
1 : ¥159.11000
Bulk
Bulk
Active
Top Mount
Full Brick DC/DC Converter
Bolt On
Rectangular, Angled Fins
4.598" (116.80mm)
2.401" (61.00mm)
-
0.449" (11.40mm)
-
5.20°C/W @ 200 LFM
-
Aluminum
Gold Anodized
ATS-61600D-C2-R0
ATS-61600D-C2-R0
FANSINK ASSEMBLY W/ MOUNTING HAR
Advanced Thermal Solutions Inc.
0
In Stock
Check Lead Time
1 : ¥196.54000
Bulk
Bulk
Active
Top Mount
BGA
Push Pin, Thermal Material
Square, Pin Fins
2.480" (63.00mm)
2.480" (63.00mm)
-
0.374" (9.50mm)
-
-
-
-
-
Showing
of 17

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.