Adhesives, Epoxies, Greases, Pastes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Size / Dimension	Usable Temperature Range	Color	Thermal Conductivity	Features	Shelf Life	Storage/Refrigeration Temperature

TC3-1G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	382 In Stock	1 : ¥51.67000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	1 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
CW7270 HEAT SINK GREASE SILICONE FREE Chemtronics	580 In Stock	1 : ¥128.28000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	7 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	0.71W/m-K	-	60 Months	-
8329TCS-6ML ADHESIVE - THERMAL CONDUCTIVE EP MG Chemicals	135 In Stock	1 : ¥238.92000 Bulk	8329TCS	Bulk	Active	Epoxy, 2 Part	6 ml Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	1.40W/m-K	Low Outgassing (ASTM E595)	36 Months	50°F ~ 86°F (10°C ~ 30°C)
8349TFM-50ML THERMAL ADHESIVE 50ML MG Chemicals	59 In Stock	1 : ¥473.68000 Bulk	-	Bulk	Active	Epoxy, 2 Part	50 ml Cartridges	-67°F ~ 329°F (-50°C ~ 165°C)	White	0.90W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
TT4000 NANO THERMAL GREASE, 5G IN A SYR Shiu Li Technology Co., Ltd.	489 In Stock	1 : ¥110.48000 Bag	LiPOLY® TT4000	Bag	Active	Silicone Grease	5 gram Syringe	-60°C ~ 180°C	White	8.00W/m-K	-	60 Months	41°F ~ 95°F (5°C ~ 35°C)
X-PUTTY-100 THERMAL PUTTY 100G, GRAY COLOR, Shiu Li Technology Co., Ltd.	178 In Stock	1 : ¥344.84000 Retail Package	LiPOLY® X-putty	Retail Package	Active	Silicone Putty	100 gram Cartridge	-76°F ~ 356°F (-60°C ~ 180°C)	Gray	3.00W/m-K	-	60 Months	41°F ~ 95°F (5°C ~ 35°C)
SH-PUTTY3-100 THERMAL PUTTY 100G, GRAY COLOR, Shiu Li Technology Co., Ltd.	302 In Stock	1 : ¥924.40000 Retail Package	LiPOLY® SH-putty3	Retail Package	Active	Silicone Putty	100 gram Cartridge	-76°F ~ 356°F (-60°C ~ 180°C)	Gray	8.00W/m-K	-	60 Months	41°F ~ 95°F (5°C ~ 35°C)
S-PUTTY5-100 THERMAL PUTTY 100G, BLUE COLOR, Shiu Li Technology Co., Ltd.	191 In Stock	1 : ¥1,256.64000 Bag	S-PUTTY5	Bag	Active	Non-Silicone Putty	30cc Tube	-	Blue	10.00W/m-K	-	60 Months	41°F ~ 95°F (5°C ~ 35°C)
TC3-10G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	98 In Stock	1 : ¥329.53000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
TC1-20G HEAT SINK COMPOUND - HIGH DENSIT Chip Quik Inc.	69 In Stock	1 : ¥110.09000 Bulk	-	Bulk	Active	Silicone Compound	20 gram Syringe	-	White	0.67W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
TC3-3.5G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	61 In Stock	1 : ¥129.82000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	3.5 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
TC4-2G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	11 In Stock	1 : ¥153.26000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	2 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)
TC4-10G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	19 In Stock	1 : ¥290.11000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)
127-12-10 GREASE 10CC SYRINGE 12W/M-K NON Wakefield-Vette	21 In Stock	1 : ¥561.42000 Bulk	127	Bulk	Active	Non-Silicone Grease	10cc Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	Gray	12.00W/m-K	-	29 Months	-
TC2-50G HEAT SINK COMPOUND - GREY ULTRA Chip Quik Inc.	11 In Stock	1 : ¥849.70000 Bulk	-	Bulk	Active	Silicone Compound	50 gram Jar	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	4.30W/m-K	-	24 Months	37°F ~ 77°F (3°C ~ 25°C)
127-20-10 GREASE 10CC SYRINGE 20W/M-K NON Wakefield-Vette	0 In Stock Check Lead Time	1 : ¥800.22000 Bulk	127	Bulk	Active	Non-Silicone Grease	10cc Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	Gray	20.00W/m-K	-	29 Months	-

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Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.