RFI and EMI - Contacts, Fingerstock and Gaskets

Results: 3
Manufacturer
Harwin Inc.Laird Technologies EMI
Series
-B3GEZ BoardWare
Packaging
BulkCut Tape (CT)Digi-Reel®Tape & Reel (TR)
Type
FingerstockShield ClipShield Finger, Pre-Loaded
Width
0.039" (1.00mm)0.098" (2.50mm)0.119" (3.00mm)
Length
0.157" (4.00mm)0.236" (6.00mm)0.256" (6.50mm)
Height
0.050" (1.28mm)0.236" (6.00mm)0.394" (10.00mm)
Material
Beryllium CopperCopper AlloyStainless Steel
Plating
GoldTin
Plating - Thickness
118.11µin (3.00µm)-Flash
Operating Temperature
-55°C ~ 125°C-40°C ~ 85°C-
Stocking Options
Environmental Options
Media
Marketplace Product
3Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Shape
Width
Length
Height
Material
Plating
Plating - Thickness
Attachment Method
Operating Temperature
S7051-42R
S7051-42R
RFI SHLD FINGER CU GOLD SOLDER
Harwin Inc.
57,731
In Stock
1 : ¥5.42000
Cut Tape (CT)
1,400 : ¥2.10036
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Shield Finger, Pre-Loaded
-
0.098" (2.50mm)
0.157" (4.00mm)
0.236" (6.00mm)
Copper Alloy
Gold
Flash
Solder
-55°C ~ 125°C
S0961-46R
S0961-46R
RFI SHLD CLIP SS TIN SOLDER
Harwin Inc.
10,668
In Stock
1 : ¥3.53000
Cut Tape (CT)
10,000 : ¥0.68118
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Shield Clip
-
0.039" (1.00mm)
0.256" (6.50mm)
0.050" (1.28mm)
Stainless Steel
Tin
118.11µin (3.00µm)
Solder
-40°C ~ 85°C
67B3G2504807010R0B
67B3G3006010010R0C
RFI FINGERSTOCK BECU GOLD SOLDER
Laird Technologies EMI
2,474
In Stock
1 : ¥24.91000
Cut Tape (CT)
500 : ¥14.77052
Bulk
Cut Tape (CT)
Digi-Reel®
Bulk
Active
Fingerstock
-
0.119" (3.00mm)
0.236" (6.00mm)
0.394" (10.00mm)
Beryllium Copper
Gold
-
Solder
-
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of 3

RFI and EMI - Contacts, Fingerstock and Gaskets

Fingerstock and gasket contacts limit electromagnetic interference (EMI), also called radio-frequency interference (RFI) when in the radio frequency spectrum, that affect electrical circuits by electromagnetic induction, electrostatic coupling, or conduction. They are used where removable parts or doors attach to a chassis or enclosure, making them susceptible to EMI. Contacts are attached using adhesive, clips, hardware, solder, slotting or snap-in channels.