Power Driver Modules

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Configuration	Current	Voltage	Voltage - Isolation	Grade	Mounting Type	Package / Case

IKCM30F60GDXKMA1 IFPS MODULE 600V 30A 24PWRDIP Infineon Technologies	112 In Stock	1 : ¥162.37000 Tube	CIPOS™	Tube	Active	IGBT	3 Phase	30 A	600 V	2000Vrms	-	Through Hole	24-PowerDIP Module (1.028", 26.10mm)
IM818LCCXKMA1 CIPOS MAXI 1200V 15A PG-MDIP-24 Infineon Technologies	259 In Stock	1 : ¥303.60000 Tube	CIPOS™	Tube	Active	IGBT	3 Phase Inverter	20 A	1.2 kV	2500Vrms	-	Through Hole	24-PowerDIP Module (1.094", 27.80mm)
NFVA35065L42 ASPM27 V3 650V/50A (FOR TICO) onsemi	142 In Stock	1 : ¥314.89000 Tube	ASPM 27	Tube	Active	IGBT	3 Phase Inverter	50 A	650 V	2500Vrms	-	Through Hole	27-PowerDIP Module (1.205", 30.60mm)
FAM65V05DF1 AUTO PWR MODUL 650V 50A 27PWRDIP onsemi	52 In Stock	1 : ¥436.28000 Tube	Auto SPM®	Tube	Obsolete	IGBT	3 Phase	50 A	650 V	2500Vrms	Automotive	Through Hole	27-PowerDIP Module (0.300", 7.62mm)
BM64377S-VA 600V IGBT INTELLIGENT POWER MODU Rohm Semiconductor	6 In Stock	1 : ¥231.91000 Tube	-	Tube	Active	IGBT	3 Phase Inverter	30 A	600 V	1500Vrms	-	Through Hole	25-PowerDIP Module (1.134", 28.80mm)
FNB35060T PWR DRVR MOD 600V 50A 27PWRDIP onsemi	0 In Stock Check Lead Time	1 : ¥260.48000 Tube	Motion SPM® 3	Tube	Active	IGBT	3 Phase Inverter	50 A	600 V	2500Vrms	-	Through Hole	27-PowerDIP Module (1.205", 30.60mm)
BM64375S-VA 600V IGBT INTELLIGENT POWER MODU Rohm Semiconductor	0 In Stock Check Lead Time	60 : ¥159.74917 Tube	-	Tube	Active	IGBT	3 Phase Inverter	20 A	600 V	1500Vrms	-	Through Hole	25-PowerDIP Module (1.134", 28.80mm)
BM63377S-VA 600V IGBT INTELLIGENT POWER MODU Rohm Semiconductor	1 In Stock	1 : ¥240.05000 Tube	-	Tube	Active	IGBT	3 Phase Inverter	30 A	600 V	1500Vrms	-	Through Hole	25-PowerDIP Module (1.134", 28.80mm)

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Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.