Heat Sinks

Results: 7
Manufacturer
Advanced Thermal Solutions Inc.Boyd Laconia, LLCCUI Devices
Series
-37432HSBmaxiFLOW
Packaging
BoxBulk
Type
Board LevelTop Mount
Package Cooled
BGABGA, FPGA
Attachment Method
Adhesive (Not Included)Thermal Tape, Adhesive (Included)
Shape
Square, Angled FinsSquare, Pin Fins
Length
0.900" (23.00mm)0.906" (23.00mm)0.906" (23.01mm)1.063" (27.00mm)1.575" (40.00mm)
Width
0.906" (23.00mm)0.906" (23.01mm)1.063" (27.00mm)1.575" (40.01mm)
Fin Height
0.394" (10.00mm)0.689" (17.50mm)0.709" (18.00mm)0.984" (25.00mm)
Power Dissipation @ Temperature Rise
1.0W @ 40°C2.0W @ 30°C3.0W @ 90°C3.7W @ 75°C4.0W @ 80°C6.13W @ 75°C-
Thermal Resistance @ Forced Air Flow
3.80°C/W @ 200 LFM4.30°C/W @ 200 LFM5.10°C/W @ 200 LFM6.50°C/W @ 200 LFM6.80°C/W @ 200 LFM9.30°C/W @ 200 LFM11.70°C/W @ 200 LFM
Thermal Resistance @ Natural
12.00°C/W12.23°C/W20.30°C/W20.41°C/W30.60°C/W40.00°C/W-
Material
AluminumAluminum Alloy
Material Finish
Black AnodizedBlue Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
7Results
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of 7
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB18-232310
HSB18-232310
HEAT SINK, BGA, 23 X 23 X 10 MM
CUI Devices
4,468
In Stock
1 : ¥5.99000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.906" (23.00mm)
0.906" (23.00mm)
-
0.394" (10.00mm)
3.7W @ 75°C
6.80°C/W @ 200 LFM
20.41°C/W
Aluminum Alloy
Black Anodized
HSB23-232325
HSB23-232325
HEAT SINK, BGA, 23 X 23 X 25 MM
CUI Devices
355
In Stock
1 : ¥11.25000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.906" (23.00mm)
0.906" (23.00mm)
-
0.984" (25.00mm)
6.13W @ 75°C
3.80°C/W @ 200 LFM
12.23°C/W
Aluminum Alloy
Black Anodized
374024B00035G
374024B00035G
HEATSINK BGA 23X23X10MM W/ADH
Boyd Laconia, LLC
577
In Stock
1 : ¥15.84000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.906" (23.01mm)
0.906" (23.01mm)
-
0.394" (10.00mm)
1.0W @ 40°C
11.70°C/W @ 200 LFM
40.00°C/W
Aluminum
Black Anodized
374424B00035G
374424B00035G
HEATSINK BGA W/ADHESIVE TAPE
Boyd Laconia, LLC
2,003
In Stock
1 : ¥19.29000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.709" (18.00mm)
4.0W @ 80°C
6.50°C/W @ 200 LFM
20.30°C/W
Aluminum
Black Anodized
374324B00035G
374324B00035G
HEATSINK BGA W/ADHESIVE TAPE
Boyd Laconia, LLC
708
In Stock
1 : ¥19.62000
Box
Box
Active
Board Level
BGA, FPGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.394" (10.00mm)
3.0W @ 90°C
9.30°C/W @ 200 LFM
30.60°C/W
Aluminum
Black Anodized
375024B00032(G)
375024B00032G
HEATSINK BGA W/ADHESIVE TAPE
Boyd Laconia, LLC
1,330
In Stock
1 : ¥26.11000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.01mm)
-
0.709" (18.00mm)
2.0W @ 30°C
4.30°C/W @ 200 LFM
12.00°C/W
Aluminum
Black Anodized
884
In Stock
1 : ¥65.76000
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Angled Fins
0.900" (23.00mm)
0.906" (23.01mm)
-
0.689" (17.50mm)
-
5.10°C/W @ 200 LFM
-
Aluminum
Blue Anodized
Showing
of 7

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.