374324B00035G | |
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DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Type | Description | Select All |
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Category | ||
Mfr | ||
Series | ||
Packaging | Box | |
Part Status | Active | |
Type | Board Level | |
Package Cooled | BGA, FPGA | |
Attachment Method | Thermal Tape, Adhesive (Included) | |
Shape | Square, Pin Fins | |
Length | 1.063" (27.00mm) | |
Width | 1.063" (27.00mm) | |
Diameter | - | |
Fin Height | 0.394" (10.00mm) | |
Power Dissipation @ Temperature Rise | 3.0W @ 90°C | |
Thermal Resistance @ Forced Air Flow | 9.30°C/W @ 200 LFM | |
Thermal Resistance @ Natural | 30.60°C/W | |
Material | ||
Material Finish | Black Anodized | |
Shelf Life | - | |
Base Product Number |
Quantity | Unit Price (Including 13% VAT) | Ext Price (Including 13% VAT) |
---|---|---|
1 | ¥19.62000 | ¥19.62 |
10 | ¥19.09600 | ¥190.96 |
25 | ¥18.58040 | ¥464.51 |
50 | ¥17.54760 | ¥877.38 |
100 | ¥16.51570 | ¥1,651.57 |
250 | ¥15.48368 | ¥3,870.92 |
500 | ¥14.96762 | ¥7,483.81 |
1,000 | ¥13.41925 | ¥13,419.25 |
5,000 | ¥13.16120 | ¥65,806.00 |