Heat Sinks

Results: 15
Manufacturer
Advanced Thermal Solutions Inc.Assmann WSW ComponentsBoyd Laconia, LLCCTS Thermal Management ProductsCUI Devicest-Global TechnologyWakefield-Vette
Series
-518624APFBDNfanSINK, maxiGRIPHSBPenguinpushPIN™TGH
Packaging
BoxBulkTray
Type
Board LevelTop Mount
Package Cooled
-Assorted (BGA, LGA, CPU, ASIC...)BGAHalf Brick DC/DC Converter
Attachment Method
-Adhesive (Not Included)Bolt OnClip, Thermal MaterialPush PinThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
Rectangular, FinsSquare, FinsSquare, Pin Fins
Length
0.394" (10.00mm)0.472" (12.00mm)0.650" (16.51mm)0.669" (17.00mm)0.827" (21.00mm)1.181" (30.00mm)1.220" (31.00mm)1.575" (40.00mm)1.610" (40.89mm)2.126" (54.00mm)2.402" (61.00mm)
Width
0.394" (10.00mm)0.472" (12.00mm)0.653" (16.59mm)0.669" (17.00mm)0.827" (21.00mm)1.181" (30.00mm)1.220" (31.00mm)1.575" (40.00mm)1.575" (40.01mm)1.610" (40.89mm)2.126" (54.00mm)2.280" (57.91mm)
Fin Height
0.157" (4.00mm)0.236" (6.00mm)0.250" (6.35mm)0.260" (6.60mm)0.275" (7.00mm)0.350" (8.89mm)0.355" (9.02mm)0.394" (10.00mm)0.450" (11.43mm)0.453" (11.50mm)0.709" (18.00mm)0.768" (19.50mm)0.950" (24.13mm)
Power Dissipation @ Temperature Rise
2.0W @ 30°C3.1W @ 75°C6.3W @ 75°C9.4W @ 75°C11.0W @ 60°C-
Thermal Resistance @ Forced Air Flow
1.50°C/W @ 200 LFM2.00°C/W @ 300 LFM2.60°C/W @ 200 LFM3.90°C/W @ 200 LFM4.30°C/W @ 200 LFM4.40°C/W @ 200 LFM4.50°C/W @ 400 LFM8.00°C/W @ 500 LFM8.40°C/W @ 200 LFM14.83°C/W @ 100 LFM15.00°C/W @ 200 LFM25.52°C/W @ 200 LFM-
Thermal Resistance @ Natural
7.96°C/W11.84°C/W12.00°C/W13.50°C/W23.91°C/W27.00°C/W31.00°C/W-
Material
AluminumAluminum Alloy
Material Finish
-Black AnodizedBlue Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
15Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
3,670
In Stock
1 : ¥6.08000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.472" (12.00mm)
0.472" (12.00mm)
-
0.709" (18.00mm)
-
-
27.00°C/W
Aluminum Alloy
Black Anodized
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
6,440
In Stock
1 : ¥8.87000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
LTN20069-T5
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Wakefield-Vette
12,058
In Stock
1 : ¥16.83000
Bulk
Bulk
Active
Board Level
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.650" (16.51mm)
0.653" (16.59mm)
-
0.350" (8.89mm)
-
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
451
In Stock
1 : ¥53.77000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
1.181" (30.00mm)
1.181" (30.00mm)
-
0.250" (6.35mm)
-
4.40°C/W @ 200 LFM
-
Aluminum
Black Anodized
518-95AB
518-95AB
HEATSINK DC/DC HALF BRICK VERT
Wakefield-Vette
4,009
In Stock
1 : ¥56.32000
Bulk
Bulk
Active
Board Level
Half Brick DC/DC Converter
Bolt On
Rectangular, Fins
2.402" (61.00mm)
2.280" (57.91mm)
-
0.950" (24.13mm)
11.0W @ 60°C
2.00°C/W @ 300 LFM
-
Aluminum
Black Anodized
321
In Stock
1 : ¥148.02000
Bulk
Bulk
Active
Top Mount
BGA
Clip, Thermal Material
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.768" (19.50mm)
-
1.50°C/W @ 200 LFM
-
Aluminum
Black Anodized
HSB15-404010
HSB15-404010
HEAT SINK, BGA, 40 X 40 X 10 MM
CUI Devices
499
In Stock
1 : ¥9.11000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.394" (10.00mm)
6.3W @ 75°C
3.90°C/W @ 200 LFM
11.84°C/W
Aluminum Alloy
Black Anodized
HSB16-404018
HSB16-404018
HEAT SINK, BGA, 40 X 40 X 18 MM
CUI Devices
1,112
In Stock
1 : ¥18.31000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.709" (18.00mm)
9.4W @ 75°C
2.60°C/W @ 200 LFM
7.96°C/W
Aluminum Alloy
Black Anodized
624-45ABT3
624-45ABT3
HEATSINK CPU 21MM SQ W/ADH BLK
Wakefield-Vette
16,797
In Stock
1 : ¥25.20000
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.827" (21.00mm)
0.827" (21.00mm)
-
0.450" (11.43mm)
-
15.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
375024B00032(G)
375024B00032G
HEATSINK BGA W/ADHESIVE TAPE
Boyd Laconia, LLC
1,335
In Stock
1 : ¥26.11000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.01mm)
-
0.709" (18.00mm)
2.0W @ 30°C
4.30°C/W @ 200 LFM
12.00°C/W
Aluminum
Black Anodized
TGH-0300-01
TGH-0300-01
ALUMINIUM HEAT SINK 30X30MM
t-Global Technology
218
In Stock
1 : ¥16.09000
Bulk
Bulk
Active
Top Mount
-
-
Square, Pin Fins
1.181" (30.00mm)
1.181" (30.00mm)
-
0.260" (6.60mm)
-
-
-
Aluminum
-
V2017B
V2017B
HEATSINK ANOD ALUM CPU
Assmann WSW Components
857
In Stock
1 : ¥4.52000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
-
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
-
-
31.00°C/W
Aluminum
Black Anodized
100
In Stock
1 : ¥44.09000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
1.220" (31.00mm)
1.220" (31.00mm)
-
0.157" (4.00mm)
-
25.52°C/W @ 200 LFM
-
Aluminum
Black Anodized
90
In Stock
1 : ¥53.86000
Tray
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
2.126" (54.00mm)
2.126" (54.00mm)
-
0.236" (6.00mm)
-
14.83°C/W @ 100 LFM
-
Aluminum
Blue Anodized
HEATSINK CPU W/ADHESIVE 1.61"SQ
BDN16-3CB/A01
HEATSINK CPU W/ADHESIVE 1.61"SQ
CTS Thermal Management Products
0
In Stock
Check Lead Time
2,000 : ¥32.14438
Tray
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.610" (40.89mm)
1.610" (40.89mm)
-
0.355" (9.02mm)
-
4.50°C/W @ 400 LFM
13.50°C/W
Aluminum
Black Anodized
Showing
of 15

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.