Heat Sinks

Results: 16
Manufacturer
Advanced Thermal Solutions Inc.Assmann WSW ComponentsBoyd Laconia, LLCCUI DevicesDFRobotSeeed Technology Co., LtdWatterott Electronic GmbH
Series
-HSBHSELattePandapushPIN™
Packaging
BoxBulkTray
Type
Top MountTop Mount Kit
Package Cooled
-Assorted (BGA, LGA, CPU, ASIC...)BGARaspberry PiRaspberry Pi 4BRaspberry Pi B+Stepper Motor Driver Board
Attachment Method
AdhesiveAdhesive (Not Included)Push PinThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
-RectangularSquare, Angled FinsSquare, FinsSquare, Pin Fins
Length
0.335" (8.50mm)0.354" (9.00mm)0.394" (10.00mm)0.472" (12.00mm)0.520" (13.20mm)0.591" (15.00mm)0.598" (15.19mm)0.669" (17.00mm)0.748" (19.00mm)0.984" (25.00mm)-
Width
0.335" (8.50mm)0.354" (9.00mm)0.394" (10.00mm)0.472" (12.00mm)0.476" (12.10mm)0.480" (12.19mm)0.591" (15.00mm)0.598" (15.19mm)0.669" (17.00mm)0.748" (19.00mm)0.984" (25.00mm)-
Fin Height
0.189" (4.80mm)0.236" (6.00mm)0.252" (6.40mm)0.275" (7.00mm)0.315" (8.00mm)0.374" (9.50mm)0.453" (11.50mm)0.472" (12.00mm)0.492" (12.50mm)0.590" (15.00mm)0.709" (18.00mm)-
Power Dissipation @ Temperature Rise
1.9W @ 75°C2.0W @ 75°C2.5W @ 75°C3.1W @ 75°C3.5W @ 75°C-
Thermal Resistance @ Forced Air Flow
6.70°C/W @ 200 LFM8.40°C/W @ 200 LFM9.60°C/W @ 200 LFM12.18°C/W @ 100 LFM13.10°C/W @ 200 LFM16.00°C/W @ 200 LFM16.50°C/W @ 200 LFM17.60°C/W @ 200 LFM24.00°C/W @ 200 LFM29.50°C/W @ 200 LFM-
Thermal Resistance @ Natural
21.44°C/W23.91°C/W24.01°C/W29.73°C/W32.00°C/W37.90°C/W39.10°C/W62.50°C/W-
Material
AluminumAluminum AlloyCopper
Material Finish
-Black AnodizedBlue Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
16Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
110991327
110991327
HEAT SINK KIT FOR RASPBERRY PI 4
Seeed Technology Co., Ltd
28,079
In Stock
1 : ¥8.13000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi 4B
Adhesive
-
-
-
-
-
-
-
-
Aluminum
-
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
8,360
In Stock
1 : ¥8.87000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
375424B00034G
375424B00034G
HEATSINK PIN-FIN W/TAPE
Boyd Laconia, LLC
3,693
In Stock
1 : ¥10.92000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.598" (15.19mm)
0.598" (15.19mm)
-
0.252" (6.40mm)
-
17.60°C/W @ 200 LFM
62.50°C/W
Aluminum
Black Anodized
1,835
In Stock
1 : ¥26.93000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.984" (25.00mm)
0.984" (25.00mm)
-
0.590" (15.00mm)
-
12.18°C/W @ 100 LFM
-
Aluminum
Blue Anodized
1,125
In Stock
1 : ¥57.55000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Fins
0.591" (15.00mm)
0.591" (15.00mm)
-
0.374" (9.50mm)
-
29.50°C/W @ 200 LFM
-
Aluminum
Black Anodized
29,583
In Stock
1 : ¥3.20000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
HSB02-101007
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
CUI Devices
4,830
In Stock
1 : ¥5.50000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
2.0W @ 75°C
16.50°C/W @ 200 LFM
37.90°C/W
Aluminum Alloy
Black Anodized
HSB01-080808
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
CUI Devices
3,779
In Stock
1 : ¥5.99000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
1.9W @ 75°C
16.00°C/W @ 200 LFM
39.10°C/W
Aluminum Alloy
Black Anodized
HSB04-171706
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
CUI Devices
1,602
In Stock
1 : ¥6.65000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.236" (6.00mm)
2.5W @ 75°C
13.10°C/W @ 200 LFM
29.73°C/W
Aluminum Alloy
Black Anodized
HSB03-121218
HSB03-121218
HEAT SINK, BGA, 12 X 12 X 18 MM
CUI Devices
1,905
In Stock
1 : ¥7.47000
Tray
Tray
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.472" (12.00mm)
0.472" (12.00mm)
-
0.709" (18.00mm)
3.1W @ 75°C
9.60°C/W @ 200 LFM
24.01°C/W
Aluminum Alloy
Black Anodized
114990125
114990125
HEAT SINK KIT FOR RASPBERRY PI
Seeed Technology Co., Ltd
3,278
In Stock
1 : ¥8.13000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi B+
Adhesive
Square, Fins
-
-
-
-
-
-
-
Aluminum
-
1,417
In Stock
1 : ¥59.35000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Fins
0.748" (19.00mm)
0.748" (19.00mm)
-
0.374" (9.50mm)
-
24.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
HSE02-173213
HSE02-173213
HEAT SINK, EXTRUSION, 17 X 31.9
CUI Devices
2,791
In Stock
1 : ¥8.13000
Box
Box
Active
Top Mount
-
Thermal Tape, Adhesive (Not Included)
Square, Angled Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.492" (12.50mm)
3.5W @ 75°C
6.70°C/W @ 200 LFM
21.44°C/W
Aluminum Alloy
Blue Anodized
FIT0367
FIT0367
RASPBERRY PI COPPER HEATSINK
DFRobot
493
In Stock
1 : ¥8.13000
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi
Thermal Tape, Adhesive (Included)
Rectangular
0.520" (13.20mm)
0.476" (12.10mm)
-
-
-
-
-
Copper
-
FIT0506
FIT0506
PURE COPPER HEATSINK PACK OF 5 (
DFRobot
75
In Stock
1 : ¥36.94000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Rectangular
0.520" (13.20mm)
0.480" (12.19mm)
-
0.189" (4.80mm)
-
-
-
Copper
-
20188
20188
SILENTSTEPSTICK HEATSINK 9 X 9 X
Watterott Electronic GmbH
0
In Stock
Check Lead Time
1 : ¥7.63000
Bulk
-
Bulk
Active
Top Mount
Stepper Motor Driver Board
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.354" (9.00mm)
0.354" (9.00mm)
-
0.472" (12.00mm)
-
-
-
Aluminum
Black Anodized
Showing
of 16

Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.