Single Diodes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Technology	Voltage - DC Reverse (Vr) (Max)	Current - Average Rectified (Io)	Voltage - Forward (Vf) (Max) @ If	Speed	Reverse Recovery Time (trr)	Current - Reverse Leakage @ Vr	Capacitance @ Vr, F	Mounting Type	Package / Case	Supplier Device Package	Operating Temperature - Junction

MMBD4148-7-F DIODE GEN PURP 75V 300MA SOT23-3 Diodes Incorporated	256,337 In Stock 16,725,000 Factory	1 : ¥1.07000 Cut Tape (CT) 3,000 : ¥0.17793 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	75 V	300mA	1.25 V @ 150 mA	Fast Recovery =< 500ns, > 200mA (Io)	4 ns	1 µA @ 75 V	2pF @ 0V, 1MHz	Surface Mount	TO-236-3, SC-59, SOT-23-3	SOT-23-3	-65°C ~ 150°C
1N4148W-7-F DIODE GEN PURP 100V 300MA SOD123 Diodes Incorporated	464,043 In Stock	1 : ¥1.31000 Cut Tape (CT) 3,000 : ¥0.23193 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	100 V	300mA	1.25 V @ 150 mA	Fast Recovery =< 500ns, > 200mA (Io)	4 ns	1 µA @ 100 V	2pF @ 0V, 1MHz	Surface Mount	SOD-123	SOD-123	-55°C ~ 150°C
PDS4150-13 DIODE SCHOTTKY 150V 4A POWERDI5 Diodes Incorporated	17,969 In Stock	1 : ¥6.90000 Cut Tape (CT) 5,000 : ¥2.71942 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Schottky	150 V	4A	760 mV @ 4 A	Fast Recovery =< 500ns, > 200mA (Io)	-	10 µA @ 150 V	-	Surface Mount	PowerDI™ 5	PowerDI™ 5	-65°C ~ 175°C
S3B-13-F DIODE GEN PURP 100V 3A SMC Diodes Incorporated	74,359 In Stock 99,000 Factory	1 : ¥2.87000 Cut Tape (CT) 3,000 : ¥0.86203 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	100 V	3A	1.15 V @ 3 A	Standard Recovery >500ns, > 200mA (Io)	-	10 µA @ 100 V	40pF @ 4V, 1MHz	Surface Mount	DO-214AB, SMC	SMC	-65°C ~ 150°C

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Single Diodes

Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.