HF115AC-0.0055-AC-90 is out of stock and can be placed on backorder.
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Laird Technologies - Thermal Materials
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Datasheet

HF115AC-0.0055-AC-90

DigiKey Part Number
BER169-ND
Manufacturer
Manufacturer Product Number
HF115AC-0.0055-AC-90
Description
THERM PAD 21.84MMX18.79MM W/ADH
Manufacturer Standard Lead Time
10 Weeks
Customer Reference
Detailed Description
Thermal Pad Gray 21.84mm x 18.79mm Rectangular Adhesive - One Side
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Bergquist
Series
Packaging
Bulk
Part Status
Active
Usage
TO-218, TO-220, TO-247
Type
Pad, Sheet
Shape
Rectangular
Outline
21.84mm x 18.79mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8W/m-K
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Base Product Number
All prices are in CNY
Bulk
QuantityUnit Price
(Including 13% VAT)
Ext Price
(Including 13% VAT)
1¥19.02000¥19.02
10¥16.99300¥169.93
50¥15.23240¥761.62
100¥13.47480¥1,347.48
500¥11.71696¥5,858.48
1,000¥8.78772¥8,787.72
5,000¥7.61603¥38,080.15
Manufacturers Standard Package