Virtex® UltraScale+™ devices offer up to 128 transceivers operating at up to 32.75 Gb/s for GTY or up to 58 Gb/s for GTM. For security and reliability, these devices support secure and non-secure boot with optional AES-GCM (advanced encryption standard - Galois/counter mode) decryption and authentication logic. UltraScale+ devices have more efficient SEU performance due to the capabilities of the FinFET transistor, which increases overall reliability, availability, and ability to eliminate silent data corruption. Enhanced DSP slices offer up to 38 TOPs (22 TeraMACs) of DSP compute bandwidth. Integrated blocks for PCI Express with cache-coherent CCIX ports support Gen3 x16 and Gen4 x8. DDR4 external memory is supported at up to 2,666 Mb/s. The 16 nm low-power FinFET+ process technology from TSMC offers over 2x performance-per-watt compared to 7 series devices. UltraScale+ families add support for MIPI with a dedicated D-PHY in the I/O bank. Smart Connect technology enables system-wide optimization for throughput, latency, and area. It bridges different interface types intelligently. From the packaging standpoint, transceiver Tx/Rx isolation improves signal integrity. An optimal number of decoupling capacitors enables using up to 2.5x less PCB area relative to competing solutions for smallest form factor. The lidless packages are available, making devices easier to cool. UltraRAM offers 8x capacity-per-block vs. traditional embedded memory. With up to 360 Mb on-chip UltraRAM, it is a possibility for SRAM device replacement.