Virtex® UltraScale+™ devices provide high performance and integration capabilities in a 14 nm/16 nm FinFET node. AMD’s 3rd generation 3D ICs use stacked silicon interconnect (SSI) technology to break through the limitations of Moore’s Law and deliver high signal processing and serial I/O bandwidth to satisfy the most demanding design requirements. These powerful devices are ideal for compute-intensive applications ranging from 1+Tb/s networking and machine learning, to radar and early-warning systems.