In summary, the Wakefield Thermal NPI Chip Clip Heat Sinks are sized to fit device from Intel, Broadcom, Xilinx, TI and more. They are available in pin fin and elliptical fin configurations. The Chip Clip Heat Sinks are a three piece design that includes the heat sink itself, the clip and spring assembly and the thermal pad. Finally, the Chip Clip Heat Sinks fit many industry applications.