Wakefield Thermal's chip clip heat sink is a three piece design comprised of the heat sink (pin fin or elliptical fin), the integral clip with spring locking assembly and the thermal pad. The chip clip heat sink assembles onto the chip using the space between the PCB and the substrate of the solder balls. The solder balls provide a minimal gap of .5 mm to .7 mm. The contact area is the on the edge of the chip and the clipping system will not interfere with or damage the chip.