In summary, as an innovative packaging solution, the microBRICK^® module offers several advantages, both thermal and electrical. It addresses the problem of heat dissipation in two ways. In the first, the highest temperature component (typically the power MOSFET) is thermally coupled to a larger cooler component (the inductor). This thermal structure provides a superior thermal solution, as the inductor acts like a built-in heatsink. The second advantage, which is also thermal, is to better utilize the large area available under the inductor for improved MOSFET power dissipation purposes. Placing the MOSFET underneath the inductor allows for a much larger effective cross section to the PCB without any additional area penalty. From an electrical perspective, the 3D structure of the Vishay module eliminates the PCB interconnect resistance between the inductor and the switching node. This parasitic resistance is governed by the PCB’s top copper-layer thickness (typically less than 2oz), and as a part of total losses is of the same magnitude as the MOSFET’s R_DS(on) and the inductor’s DCR.