To overcome the limiting aspects of the current Package-on-Package assembly methods, Viking Technology offers an alternative substrate interconnect solution. The wire-bonded solution is protected by a mold compound that is constructed with the same thermal properties as the PCB. This allows the product to perform well in the most challenging thermal environments and enables a much finer contact spacing between lower and upper PoP sections. In this case, both upper and lower compound mold package sections are encased in a commercial mold compound.