There are many applications which need to support advanced graphics processing. Applications or trends in mobile computing require greater computing performance at lower power. To support these, a high density solution is required. An additional solution that Viking Technology offers is wire bonding package or high I/O Package-on-Package (PoP) that significantly increases bandwidth to better enable current and future smartphone and tablet features. PoP technology provides an efficient solution for system level packaging because each section can be fully tested before joining.