Viking Technology’s Multi-Chip Package (MCP) is part of the extreme density line of DDR3 and DDR4 memory products optimized for the embedded, industrial and military/aerospace markets. MCP products achieve significantly higher memory performance and density per cubic inch than conventional memory DIMMs. With MCP a full size module can fit into a small form factor, achieving up to an 85% space savings. This solution is highly useful where space is a constraint.