Thermal management has grown to become a critical, yet often overlooked, design factor in modern day electronics. Thermal management solutions must be cost effective, user friendly, and able to be developed quickly to meet the stringent requirements of today’s electronics designers. Often times though, thermal interface materials, or TIMs, are merely an afterthought in designs. However, in modern designs, TIMs play an exceptionally large role in a devices performance and reliability. Furthermore, selecting the correct TIM is critical and can allow for a significant reduction in cost and an improvement in the device’s life time.