Heat dissipation and board space are always a high priority in the design phase. Without proper cooling, devices can overheat, which leads to inefficiency and unreliability. A reduced component footprint translates to the ability to incorporate additional features to the device and/or decrease the physical board size. The HTSOP-J8 is a thermally enhanced package that is able to achieve a high dissipation rating by utilizing a metallic slug directly under the wafer-die. With the metallic slug exposed underneath the package, it can further dissipate the heat away from the package when it is soldered to a copper ground layer. When soldered to a 4-layer board, the package is able to achieve a maximum power dissipation rating of 3.76W. This design reduces the footprint of the LDO and eliminates the need for an intrusive heat sink on the surface of a PCB.