If the solution is to generate less heat under the same electrical conditions while maintaining the same footprint, then BISS is the answer. In this example, the BISS transistor has a power dissipation of 1.34 watts, whereas the general purpose transistor can only dissipate .65 watts. This is because a BISS transistor die assembled in the same package as its conventional predecessor dissipates less heat during operation. The actual power dissipation of a BISS transistor is reduced by 65% compared to a conventional transistor. Thus, a BISS transistor, using new mesh-emitter technology, can be selected to avoid hot spots on the printed circuit board, as demonstrated in these thermal images.