If PC Board level coatings are used after solder mounting, they should be carefully selected to avoid stressing components particularly glass body designs. When used they should be pliable to minimize stresses that may be induced by differences in coefficient of expansion or other transmitted forces imparted from PC board flexure. Rigid epoxy coatings have for example been known to crack glass body devices including those board coatings applied in a relatively thin layer. This may be partly stimulated by stresses imparted on a device when rigid coatings are placed in the narrow standoff relief space between the PC board and a glass body diode.