All surface mount packages may be affixed temporarily to the circuit board with a fast curing adhesive system between package body and board (separate from the defined solderable footprint) to accommodate soldering. Examples include the DO-214 and DO-215 variants as well as the double-slug, surface mount MELFS such as the DO-213AA or DO-213AB round-end-cap or the tungsten slug hard glass square-end-cap MELF products. In these examples where the body is suddenly exposed to soldering temperatures (such as in wave soldering), it is recommended that a preheat step be included that is within 100°C of the final soldering temperature to minimize thermal shock effects on the body of the device.