Maximum soldering temperatures and times for MCC diodes are typically 260°C for 10 seconds maximum. Solder profiles will generally be much lower and shorter in time than these maximums when using common solders such as Tin/Copper (Sn/Cu), Tin/Silver (Sn/Ag), or Tin/Silver/Copper (Sn/Ag/Cu). Actual time and temperature is determined by the overall thermal mass of PC boards and components along with considerations of other component sensitivity. For most through-hole axial lead devices, the body does not directly see these temperature-time extremes, however surface mount (SMD) devices do. Common surface mounting processes used in the industry are accomplished by using convection or infrared belt furnace, vapor phase reflow, or wave soldering equipment.