The 3255A can be reflow solder mounted in one of two orientations, allowing the measurement axis to be either parallel or perpendicular to the mounting surface without the use of costly brackets. For uniform heating it is recommended that the customer use ovens that utilize a full combination of convection and IR heating. Verify that there is a gradual preheating, a short time at high temperature and controlled cooling. Remove the board from the heat source in a smooth motion to ensure that the sensor is not jarred while on soft solder. A wash with de-ionized water after the soldering process will remove most residue from the board.