Increasing power density in a point-of-load design usually leads to trade-offs on size and output current support with smaller packages, typically resulting in a limited thermal dissipation capability and therefore a lower output current support. This is especially true when considering operations over a wide range of temperature. One of the key differentiators of the ISL8202M and ISL8205M, and in fact, of all Renesas' power modules, is their packaging technology. These modules rely on a copper lead frame structure where all components, including power dissipating FETs and inductors, are directly mounted to the lead frame. This technique allows for a direct heat transfer to the PCB; hence, the thermal management is more efficient allowing these devices to run cooler and more efficiently. The thermal tests, as illustrated in these curves and images, show that the ISL8205M used with its standard evaluation board with no airflow or heat sink attached to it can safely deliver 4.3 A of continuous current at 85°C ambient temperature.