This slide captures thermal performance data collected using the competitor’s solution on the left vs. the Renesas digital multiphase controller paired with the 60 A ISL99227 Smart Power Stage using a FLIR camera. As evidenced in the thermal images captured, the competing solution must de-rate current by 25% for comparable thermal performance at Tj = 106°C. It is noteworthy to highlight that Competitor B’s solution supports dual side cooling. However, their solution supports flip chip on lead package, with narrow Cu strips, resulting in much higher thermal impedance. The dual side cooling that supports large thermal pads coupled with low packaging inductance in a 5 mm x 5 mm footprint, enable the Renesas ISL99227 to achieve superior thermal performance.