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Within a conventional Peltier module structure, solder is used to bond the electrical interconnect (copper) and the P/N semiconductor elements, while soldering or sintering is used to form the bond between the electrical interconnect and the ceramic substrate. Though this process initially creates a strong mechanical, thermal, and electrical bond between these elements, the integrity of this bond can begin to degrade and thermally fatigue when subject to the repeated heating and cooling of normal Peltier module operation. The life expectancy of a Peltier module is directly tied to the quality of those bonds, with the predominant failure mode occurring as the bonds within the module thermally fatigue, resulting in an increase in resistance within the module. This effect is compounded due to the internal stresses that occur during repeated thermal cycling. However, there is a solution.
