To combat the effects of thermal fatigue, Same Sky has implemented an advanced construction technique called arcTEC™ structure, which allows for higher performance and reliability when compared to conventional thermoelectric module designs. The arcTEC™ structure replaces the conventional solder bond between the electrical interconnect and the ceramic substrate on the cold side of the module with a thermally conductive resin. This resin provides an elastic bond within the module that allows for thermal expansion and contraction during the repeated thermal cycling of Peltier module operation. The elasticity of this resin reduces stress on the elements during operation, resulting in a better thermal connection, superior mechanical bond, and no marked drop-off in performance over time. In addition to the thermally conductive resin, modules using the arcTEC™ structure replace the typical BiSn solder used between the P/N semiconductor elements with SbSn solder. Similar to the benefits of the thermally conductive resin, the SbSn solder joints offer superior resistance to thermal fatigue and better shear strength than conventional BiSn solder. Additionally, SbSn solder has a much higher melting point of 235°C compared to 138°C for BiSn.