Slide 1 Slide 2 Slide 3 Slide 4 Slide 5 Slide 6 Slide 7 Slide 8 Slide 9 Slide 10 Slide 11 Slide 12 Slide 13 Slide 14 Slide 15 Slide 16 Slide 17 Slide 18 Slide 19 Slide 20 Slide 21 Slide 22 Slide 23 Slide 24 Slide 25 Slide 26 Slide 27 Slide 28 Slide 29 Product List
int str
The semiconductor chip, a subcomponent of the OC MOSFET, is mounted on the metal support, called a lead frame which also serves as a terminal, using conductive paste. Next, the chip electrodes are connected by a fine gold wire to the lead, creating a terminal in the wire bonding step. More than one type of structure can be used to link an IRED and PVD (called a photocoupler structure). At CEL, for standard products, the face-to-face type SSR structure is used where the IRED and PVD are covered with transparent silicone rubber to form an optical path. This assembly is placed in a furnace for hardening and then over-molded with epoxy resin. For high isolation voltage type SSRs, the double mold process is used. In this process, the IRED is covered with silicone gel, and cured with heat. The entire structure is then molded with transparent epoxy resin then cured again before the over-molded with epoxy resin is applied.
PTM Published on: 2009-03-27