Some considerations to pay attention to when choosing a heat sink. The first of these are the specifications of the semiconductor component. Most information can typically be found on the component manufacturers data sheet. Most of the pertinent data that will assist the customer in determining the correct heat sink can be found here, such as Component power rating, max junction temperature, and package size. Because this PTM is mainly dealing with smaller board-level semiconductor heat sinks the designer will not be discussing considerations such as: system air flow, space limitations and operating environments in this module.