In summary, ATS introduces a comprehensive product line of stamped heat sinks, or board level cooling solutions, specifically designed to cool power modules that come in a variety of packages. The packages are standard industry-set configurations that come in a wide variety of plastic or metal packages used for cooling transistors, thyristors, and IC’s with low pin counts. These lightweight heat sinks are a cost effective way to solve low power density thermal challenges. ATS stamped heat sinks are available in anodized aluminum, copper tin-plated, steel tin-plated or aluminum tin-plated materials. The solderable tabs allow for easy assembly in encapsulated and through-hole packages.