ATS' maxiGRIP™ and superGRIP™ clipKIT™ heat sink attachments are both two-component attachment systems that quickly and securely mount heat sinks to a wide range of Ball Grid Array (BGA) components, while using a minimal keep out area on the PCB and eliminating the need to drill holes. The resulting clipKIT assembly applies steady, even pressure to the component throughout the product lifecycle, improving thermal performance and long-term reliability.