Both clipKIT™ assemblies come standard with clean-break, reworkable, Chomerics T-766 phase change material. The strong, uniform attachment force created by the spring clip helps achieve maximum thermal performance and improves heat transfer 20% more than typical double-sided adhesive thermal tapes. Phase change TIM, under the right amount of pressure, can improve the thermal performance from 10% to 20% in a given application. In the top chart, displayed here, the steady pressure acts to mate the interface material to the mating surface, minimizing the amount of air remaining at the interface, thereby decreasing the thermal resistance. In the bottom chart, heat is transferred at a consistent, steady rate as the result of the phase change material.