DIP Sockets and SIP Sockets

TE Connectivity (TE) dual in-line package (DIP) sockets provide a separable electrical and mechanical connection between an electronic component and a printed circuit board (PCB). DIP sockets enable easy replacement of components received by such sockets. The use of DIP sockets can also minimize the risk of damage to components received by the sockets that might occur if the component were directly soldered to the PCB.

TE single in-line package (SIP) sockets with a machined female header provide a highly reliable connection between the integrated circuit device and the PCB. Compared with DIP sockets, SIP sockets are typically more compact, enabling them to handle higher-density configurations.

Benefits

• Supports quick mating and unmating
• Enables easy replacement of the IC
• Minimizes the risk of the IC overheating during soldering
• Provides improved vibration resistance with a multi-contact beam design
• Durability up to 500 cycles with gold plating
• Supports flame resistance with a UL 94V-0 rating and a polyphenylene sulfide (PPS) housing
• Offers various specifications to address customer demands