Heat Sinks

Results: 3
Manufacturer
Assmann WSW ComponentsCTS Thermal Management Products
Series
-BDN
Packaging
BoxTray
Attachment Method
Thermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Length
0.910" (23.11mm)1.209" (30.70mm)1.810" (45.97mm)
Width
0.910" (23.11mm)1.209" (30.70mm)1.810" (45.97mm)
Fin Height
0.355" (9.02mm)0.555" (14.10mm)0.605" (15.37mm)
Thermal Resistance @ Forced Air Flow
2.80°C/W @ 400 LFM9.60°C/W @ 400 LFM-
Thermal Resistance @ Natural
8.10°C/W16.00°C/W26.90°C/W
Material
AluminumAluminum Alloy
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

Showing
of 3
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
1,710
In Stock
1 : ¥5.99000
Tray
-
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
1.209" (30.70mm)
1.209" (30.70mm)
-
0.555" (14.10mm)
-
-
16.00°C/W
Aluminum Alloy
Black Anodized
417
In Stock
1 : ¥7.96000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.910" (23.11mm)
0.910" (23.11mm)
-
0.355" (9.02mm)
-
9.60°C/W @ 400 LFM
26.90°C/W
Aluminum
Black Anodized
BDN18-6CB/A01
BDN18-6CB/A01
HEATSINK CPU W/ADHESIVE 1.81"SQ
CTS Thermal Management Products
0
In Stock
Check Lead Time
1 : ¥48.44000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.810" (45.97mm)
1.810" (45.97mm)
-
0.605" (15.37mm)
-
2.80°C/W @ 400 LFM
8.10°C/W
Aluminum
Black Anodized
Showing
of 3

Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.