Heat Sinks

Results: 2
Manufacturer
Assmann WSW ComponentsOhmite
Series
-R
Packaging
BoxBulk
Type
Board Level, VerticalTop Mount
Package Cooled
TO-218, TO-220, TO-247TO-263 (D²Pak)
Attachment Method
Bolt On and PC PinSMD Pad
Length
0.763" (19.38mm)1.654" (42.00mm)
Width
0.985" (25.00mm)1.000" (25.40mm)
Fin Height
0.450" (11.43mm)2.500" (63.50mm)
Power Dissipation @ Temperature Rise
4.0W @ 20°C-
Thermal Resistance @ Forced Air Flow
1.00°C/W @ 200 LFM23.00°C/W @ 300 LFM
Thermal Resistance @ Natural
3.10°C/W11.00°C/W
Material
AluminumCopper
Material Finish
Black AnodizedTin
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
V-1102-SMD/A-L
V-1102-SMD/A-L
HEATSINK TO-263 19.38X25.40MM
Assmann WSW Components
4,490
In Stock
1 : ¥11.17000
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
-
23.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
RA-T2X-64E
RA-T2X-64E
HEATSINK TO-218,TO-220,TO-247
Ohmite
549
In Stock
1 : ¥32.35000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220, TO-247
Bolt On and PC Pin
Rectangular, Fins
1.654" (42.00mm)
0.985" (25.00mm)
-
2.500" (63.50mm)
4.0W @ 20°C
1.00°C/W @ 200 LFM
3.10°C/W
Aluminum
Black Anodized
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.